R&D Engineer Die to Wafer Bonding

il y a 1 semaine


Leuven, Flandre, Belgique imec Temps plein

R&D Engineer Die to Wafer Bonding

Location: Leuven

Responsibilities:

  • Define, organize and validate materials & processes during development
  • Look for specific metrology solutions
  • Contribute to research programs and joint development programs
  • Work cross-functionally with teams and partners
  • Report about work internally and externally
  • Start fundamental research activities on new materials
  • Monitor industry trends and innovations
  • Interface with engineers and researchers
  • Implement non-standard work
  • Start-up new equipment
  • Receive on-the-job coaching

Benefits:

Join a premier research center, shape future technology, open working environment, opportunities for growth, competitive salary and fringe benefits.

Requirements:

  • Preferably a master's degree in relevant fields
  • Knowledge of metallurgy, plasma processes, and polymers
  • Experience in die-to-wafer bonding and semiconductor materials
  • Data analysis and project management skills
  • Ability to work independently with a focus on quality
  • Participate in cross-functional teams, strong communication skills
  • Enthusiastic team player, well-organized, attention to detail
  • Interest in clean room environment
  • Flexible attitude towards tasks, good English proficiency


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