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R&D Engineer Die to Wafer Bonding
il y a 1 semaine
R&D Engineer Die to Wafer Bonding
Location: Leuven
Responsibilities:
- Define, organize and validate materials & processes during development
- Look for specific metrology solutions
- Contribute to research programs and joint development programs
- Work cross-functionally with teams and partners
- Report about work internally and externally
- Start fundamental research activities on new materials
- Monitor industry trends and innovations
- Interface with engineers and researchers
- Implement non-standard work
- Start-up new equipment
- Receive on-the-job coaching
Benefits:
Join a premier research center, shape future technology, open working environment, opportunities for growth, competitive salary and fringe benefits.
Requirements:
- Preferably a master's degree in relevant fields
- Knowledge of metallurgy, plasma processes, and polymers
- Experience in die-to-wafer bonding and semiconductor materials
- Data analysis and project management skills
- Ability to work independently with a focus on quality
- Participate in cross-functional teams, strong communication skills
- Enthusiastic team player, well-organized, attention to detail
- Interest in clean room environment
- Flexible attitude towards tasks, good English proficiency
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