Modelisation of light matter interaction for temporary bonding applications

Modelisation of light matter interaction for temporary bonding applications

Master internship – Leuven (Posted more than two weeks ago)

As the semiconductor industry pivots from traditional node scaling toward system‑level innovation, temporary bonding and debonding of wafers is a key step for next industrial development. This internship focuses on improving a technique that enables the use of standard Si wafers as temporary carriers, offering a low‑cost and process‑friendly solution.

Internship type: Master internship

Duration: 6 months

Required educational background: Materials Engineering, Physics, Nanoscience & Nanotechnology

University promoter: Clement Merckling (KU Leuven)

Reference code: 2026-INT-147

Imec allowance will be provided for students studying at a non‑Belgian university.

Responsibilities

• Model the interaction between infrared laser light and debonding stack to support heat‑based debonding.
• Simulate laser absorption, predict temperature evolution, and identify process conditions that allow reliable, selective release of the device wafer.
• Guide the development of a robust and efficient laser‑assisted temporary bonding approach.

Qualifications

• Currently enrolled in a Master program in Materials Engineering, Physics, Nanoscience or Nanotechnology.
• Strong analytical and modeling skills.
• Interest in semiconductor process integration.

Application instructions

• resume
• motivation letter
• current study details

Incomplete applications will not be considered. For further information or for application, contact Francois Chancerel (Francois.Chancerel@imec.be) or John Slabbekoorn (John.Slabbekoorn@imec.be).