3D/2.5D Chiplet Architect for Memory Packaging
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Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.
You will drive architecture with multi-physics insight, perform simulations, and provide technical leadership across design, process engineering, and system teams.
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3D/2.5D Chiplet Architect — High-Performance Memory
Il y a 3 jours
Vlaams-Brabant, Vlaams-Brabant, Belgique Vertical Compute Temps plein 80 000 € - 110 000 € ContratVertical Compute is looking for a 3D Integration / Chiplet Expert to define and implement advanced packaging solutions for their Vertical Integrated Memory (VIM) technology. This role is crucial for developing architectures for 2.5D/3D stacking, conducting multi-physics simulations, and providing technical leadership across multidisciplinary teams....
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