X-ray Metrology for Micron-thick Multilayer 3D-DRAM
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Imec invites a Master student to join our metrology team for an internship focused on advanced X-ray techniques to characterize micron-thick multilayer stacks used in future memory devices. You will work with XRR, HR-XRD, GISAXS and diffuse scattering to quantify layer thickness, periodicity and interface quality, benchmarking against TEM.
The project includes analyzing spectra from ONO and Si/SiGe samples, exploring correlations between growth, morphology, and 3D memory scaling.
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