Optimization of TEM Chunk Preparation
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“Optimizing TEM sample preparation for faster, higher-quality semiconductor sample analysis.”
Transmission Electron Microscopy (TEM) is one of the mostpowerful characterization techniques used in semiconductor research andmanufacturing, providing detailed information on material structures and devicefeatures at the atomic scale. A critical first step in TEM analysis is thepreparation of TEM lamella, which begins with extracting a chunk from aspecific target region on a wafer.
This thesis focuses on optimizing the TEM chunk preparationprocess. The student will investigate the influence of key process parameters,including ion beam voltage, beam current, tool alignment, wafer composition,and feature dimensions. Through experimental work, the impact of theseparameters on milling speed and preparation quality will be evaluated.
The quality of the ion beam process will be assessed bydetermining milling rates and quantifying damage introduced outside theintended pattern area. In addition, the student will optimize patterndimensions and positioning to achieve the best balance between preparationspeed and sample quality.
Based on the results, optimal process settings andpreparation strategies will be defined to improve the efficiency and robustnessof TEM sample preparation. This project combines hands-on work with advancedsemiconductor equipment and a strong theoretical understanding of focused ionbeam (FIB) processing, offering the opportunity to contribute directly to theoptimization of TEM lamella preparation workflows in a state-of-the-artsemiconductor environment.
Type of internship: Bachelor internship
Required educational background: Chemistry/Chemical Engineering, Bioscience Engineering, Materials Engineering
Supervising scientist(s): For further information or for application, please contact Felix Seidel ( Felix.Seidel@imec.be )
The reference code for this position is 2026-INT-268. Mention this reference code in your application.
Optimization of TEM Chunk Preparation
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