Pioneering Wafer-to-Wafer Bonding Engineer

imec, based at Leuven, Belgium, invites Master interns to study the reliability of wafer-to-wafer hybrid-bonding, focusing on SiCN dielectric materials. The role involves data collection, preparation and analysis, and developing a lifetime model for reliability under various conditions.Supervising scientist Emmanuel Chery will guide the project. Duration is...

Imec in Belgium invites applications for a Master internship on the mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren. The project combines experimental measurements with heavy data analysis and some analytical modelling, supervised by Prof Pierre-Thomas Brun at KU Leuven.The internship focuses on visualizing...

Imec invites Master or PhD interns to investigate how different surface pretreatments influence metallic surfaces for advanced 3D wafer stacking. You will design and perform experiments, analyze surface evolution, and assess bonding stability of interfaces to guide scalable processes for future 3D integration technologies.The project aims to deepen...

/ [NanoIC topic] Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren[NanoIC topic] Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic SchlierenThis will be mainly an experimental project with heavy data analysis and some analytical modelling - to measure particle induced voiding in...

Interuniversitair Micro-Electronica Centrum (imec) is seeking a Process Assistant to support SEM Operations in our state-of-the-art fab. You will work hands-on with inline SEM and XSEM tools to enable high-quality wafer inspection, process monitoring, and operational excellence across the imec Fab.Collaborate with First Line Support, Equipment and Process...

IMEC is seeking a Senior Business Development Manager for IC-Link silicon services to drive growth across wafer services such as Si photonics, interposers, and heterogeneous integration. You will build strategic customer portfolios, coordinate deals, and work with technical and IP/legal teams to craft compelling offerings.You will lead pricing discussions,...

Reliability of 3D advanced technologies: the hybrid-bonding interface. Join us to to study the reliability of the most advanced 3D technology: wafer to wafer hybrid-bonding. Join imec, one of the world’s premier research centers in nanotechnology, at its headquarters in Leuven, Belgium, to study the reliability of the most advanced 3D technology: wafer to...

/ Modelisation of light matter interaction for temporary bonding applicationsModelisation of light matter interaction for temporary bonding applicationsAs the semiconductor industry pivots from traditional node scaling toward system-level innovation, temporary bonding and debonding of wafers is a key steps for next industrial development. In this internship...

Modelisation of light matter interaction for temporary bonding applications Master internship – Leuven (Posted more than two weeks ago) As the semiconductor industry pivots from traditional node scaling toward system‑level innovation, temporary bonding and debonding of wafers is a key step for next industrial development. This internship focuses on...