Optimization of SEM Cross-Section Preparation and Inspection
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/ Optimization of SEM Cross-Section Preparation and Inspection
Optimization of SEM Cross-Section Preparation and Inspection
Scanning Electron Microscopy (SEM) is anessential metrology technique in semiconductor
manufacturing, enabling high-resolutionimaging of device structures and material layers.
Both top-view and cross-sectional SEMinspections are widely used to monitor process
quality and support technology development.
This thesis focuses on developing andoptimizing a workflow for SEM cross-section
inspections. The student will investigateand optimize the key preparation and inspection
steps, including sample capping,cross-section cutting, and SEM imaging. Various imaging
parameters such as pixel resolution, dwelltime, line integration, and image integration will
be evaluated to determine their impact onimage quality.
Based on experimental results, objectiveimage quality criteria will be defined and used to
identify the optimal inspection conditions.The student will also develop standardized
pattern and beam templates to establish arobust and uniform methodology for SEM
cross-section analysis.
This project offers hands-on experiencewith advanced semiconductor metrology tools and
provides an opportunity to contributedirectly to the optimization of inspection methods
used in a state-of-the-art semiconductorfabrication environment
Type of internship: Master internship
Duration: 3 months
Required educational background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology, Physics
Supervising scientist(s): For further information or for application, please contact Felix Seidel ( Felix.Seidel@imec.be )
The reference code for this position is 2026-INT-341. Mention this reference code in your application.
Only for self-supporting students.
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