Die-to-Wafer Bonding R&D Specialist
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IMEC in Leuven is seeking an R&D Process Engineer for Die-to-Wafer bonding to join the MAT team. You will develop, optimize, and validate D2W bonding processes, with significant time in the cleanroom, collaborating with researchers, process engineers, equipment partners, and stakeholders.
You hold a Master’s degree in Physics, Chemistry, Materials Science, or Engineering, enjoy team work and independent work, and are fluent in English.