Memory Tech Process Engineer – Deposition

(Senior) PVD Process Development EngineerWhat you will doWe are seeking a highly motivated (Senior) PVD Process Development Engineer to join our advanced semiconductor thin film deposition and diffusion technology development team (DDDEV). The successful candidate will play a key role in developing next-generation Physical Vapor Deposition (PVD) processes...

Step into a career with ASM, where cutting edge technology meets collaborative culture.For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends...

ASM is seeking a Senior Process Engineer in Leuven, Belgium to join the Process Application Development team. You will develop and optimize thin-film processes (CVD/ALD), test new applications for logic, memory and MEMS, and work closely with customers to translate findings into robust production-ready recipes.Required: PhD in a relevant field and 5+ years...

Imec in Leuven, Belgium, seeks a (Senior) PVD Process Development Engineer to advance next-generation PVD processes for CMOS logic, memory and heterogeneous integration in a state-of-the-art 300/200mm semiconductor fabrication environment.You will lead DOE studies, develop and optimize deposition processes (magnetron, reactive, RF and DC sputtering), and...

Step into a career with ASM, where cutting edge technology meets collaborative culture.For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such...

R&D Engineer for Advanced Metallization Background The continued scaling of CMOS logic and memory technologies is increasingly limited by the performance, resistivity, and integration complexity of advanced metallization schemes. As device architectures transition to deeply scaled nodes and 3D structures (e.g., CFET, high-aspect-ratio interconnects, and...

Imec's R&D headquarters in Leuven hosts the BEOL Platform team, focusing on 3D, memory and interconnect projects. This role targets an experienced Advanced Packaging (3D) Integration engineer who will drive process improvements and technical ownership in a collaborative, high‑tech environment.You will lead development plans, run inline characterization,...

R&D Engineer for bevel managementWhat you will doMiniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a...

About Us Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking...