RF Interposer for High-Bandwidth Co-Packaged Optics

/ RF Interposer for High-Bandwidth Co-Packaged Optics

RF Interposer for High-Bandwidth Co-Packaged Optics

Discover how RF interposers could bridge electronics and photonics, taking co-packaged optics from individual optical engines toward scalable optical connectivity for future AI systems.

Type of internship: Master internship

Duration: 6-12 months

Required educational background: Electrotechnics/Electrical Engineering, Physics, Nanoscience & Nanotechnology

University promotor: Nadine Collaert (VUB)

Supervising scientist(s): Xiao Sun

The reference code for this position is 2026-INT-338.

his Master’s thesis will investigate RF interposer technology as a heterogeneous integration platform for co-packaged optics. The work will explore system architectures integrating RF/electronic and photonic chiplets and will focus on the design, modeling, and optimization of high-speed interconnects and critical integration structures. Key parameters such as insertion loss, return loss, bandwidth, crosstalk, routing density, and integration constraints will be evaluated. The project will combine electromagnetic simulation with system-level analysis to identify key design trade-offs and develop guidelines for RF-interposer-enabled CPO architectures. The outcome will provide insight into how RF interposer technology can support the evolution from compact optical-engine integration toward scalable, high-bandwidth optical connectivity for future AI systems. This direction is consistent with current research examining CPO as an enabling technology for high-performance computing and AI. Co-packaged optics for high-performance computing and artificial intelligence.