Modeling Light–Matter in Laser‑Assisted Wafer Debonding
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Imec India Private Limited in Leuven is offering a Master internship focused on modelling light-matter interaction for temporary wafer bonding applications. The project aims to explore improvements to a laser-assisted technique enabling standard Si wafers as temporary carriers.
The role involves modelling the interaction between infrared laser light and debonding stack, simulating absorption, and predicting temperature evolution to identify robust process conditions for selective release of the
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Vlaams-Brabant, Vlaams-Brabant, Belgique Imec India Private Limited Temps plein 7 800 € - 11 000 € Contrat/ Modelisation of light matter interaction for temporary bonding applicationsModelisation of light matter interaction for temporary bonding applicationsMaster internship - Leuven | More than two weeks agoAs the semiconductor industry pivots from traditional node scaling toward system-level innovation, temporary bonding and debonding of wafers is a key steps...
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Vlaams-Brabant, Vlaams-Brabant, Belgique KU Leuven Temps plein 22 000 € - 33 000 € ContratThis PhD position is part of the academic network working on ecodesign, an international research and training initiative (Horizon Europe MSCA-DN). The network aims to advance digital and ecodesign methodologies that enable scalable circular economy practices, aligned with European sustainability, resource efficiency, and Digital Product Passport (DPP)...
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