RF Package Design Engineer – Contractor
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TUSK IC is a fabless millimeter-wave (mmWave) IC design company based in Antwerp, Belgium. Founded in 2018 as a KU Leuven spin-off, we’ve built a strong reputation for solving the toughest RF and semiconductor challenges in automotive, industrial, and communications markets.
Company Focus
We’re now entering a new and pivotal phase: developing our own product line of Ka-band chips and modules for satellite communications (SatCom). Our focus is on next-generation user terminals for global satellite connectivity — a market on the verge of explosive growth. “New Space” is fueling a wide range of business and investment opportunities, with communications emerging as the biggest growth market, and at the heart of strategic autonomy discussions.
Role Overview
As RF Package Design Engineer you will own the package design of our chips and products and support the integration of the chips on boards and into modules. In this role, you’ll identify and design the most optimal package solutions, model the RF and thermal behavior, and interface with the package partners. You will become a core member of our team and will be operating in a close collaboration with the IC designer team.
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