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Your Role and Responsibilities
  • You will lead the technical side of developing a Digital ASIC.
  • You will define and design the top level of the IC, specifying the architecture and liaising and controlling the sub system designers, including external partners.
  • You will be responsible for top level simulations using tools such as Cadence Xcelium.
  • You will be responsible for the pad ring, ESD, and general integration of the top level, co-ordinating the layout and driving the tape out process.

Your focus will be on product engineering and manufacturability.