IC Design Lead – ROIC Architecture

pFor our client, one of Europe’s fastest-growing advanced imaging technology companies, we are looking for an experienced bIC Design Lead /b to shape the next generation of infrared camera technology. /ppYou will develop the read-out ICs (ROICs) at the heart of high-performance imaging systems used in demanding aerospace, defence, industrial, research and security applications. This is a rare opportunity to combine deep analog/mixed-signal IC design with technology where image quality, noise, speed and reliability truly matter. /ppPlease note: The company is willing to support a relocation / visa process for this role. /ph3Your role /h3pAs the technical owner of complete ROIC development projects, you will define the top-level ROIC architecture for infrared image sensors and guide it from initial concept through tape-out and silicon validation. /ppYou will work hands‑on while providing technical direction to internal IC engineers and external design partners. Working closely with the IC Layout Lead and Project Manager, you will ensure that each chip meets its technical targets and is delivered successfully. /ph3What you will do /h3ulliOwn the technical development and delivery of high-performance ROICs for infrared imaging sensors /liliDefine the top-level readout architecture, circuit specifications and key technical trade-offs around noise, speed, power consumption, dynamic range and image quality /liliDesign, simulate and verify critical analog and mixed‑signal circuit blocks /liliLead circuit and layout reviews, make technical decisions and drive tape-out sign‑off /liliGuide internal engineers and technically steer external design and test partners /liliDefine and execute IC verification and post‑silicon validation plans, including lab characterisation /liliImprove design methodologies, tool flows and technical ways of working /liliHelp build and mentor a growing ROIC Design Team /li /ulh3What you bring /h3ulliMaster’s or PhD in Electronics, Microelectronics or a related discipline /liliExtensive hands‑on experience in analog and mixed‑signal IC design, ideally 10+ years /liliProven experience in imaging: ideally ROICs, CMOS image sensors, infrared imaging, SPAD/ToF or closely related sensor‑readout applications /liliA proven track record of owning the full ROIC or image‑sensor architecture of completed chip developments – from the initial readout concept and circuit specifications through tape‑out and silicon validation /liliStrong technical judgement and the ability to make architecture‑level design trade‑offs /liliExperience reviewing circuit design and IC layout, while understanding the distinct responsibilities of each discipline /liliExperience with Cadence and/or Siemens EDA environments /liliProfessional proficiency in English /li /ulh3What

we offer
/h3ulliA highly technical, high‑impact role in a fast‑growing advanced imaging company /liliThe chance to work on sophisticated infrared camera technology for demanding real‑world applications /liliDirect ownership of chip architecture and genuine influence on future products and engineering capability /liliA collaborative international RD environment with experts across sensors, IC design, layout, optics and camera systems /li /ulpPlease note: Due to the high volume of applications we receive, we are unfortunately unable to provide individual feedback to every applicant. /p