Principal Thermal-Mechanical Engineer- IMEC, Leuven, Belgium

h3bAbout Us /b /h3 pWe are building bPhysics AI for hardware design /b. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows. /p pBy bridging the gap between traditional simulation and machine learning, we are redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems. /p h3Role Overview /h3 pAs a Vinci engineer stationed on-site at IMEC in Leuven, Belgium, you will play a pivotal role in driving the adoption of Vinci's platform among leading engineering organizations.
This is a high-impact senior technical role — principal engineer level — where you will collaborate directly with IMEC engineers on leading-edge semiconductor technologies and demonstrate the transformative value of Vinci's software. /p pYou will bring deep, hands-on expertise in bthermal and thermo-mechanical simulation, /b validating leading-edge package and device designs directly on Vinci's platform — showing how Vinci delivers measurable gains in design quality, thermal and mechanical performance, reliability, and time-to-market. /p pLeveraging strong fundamentals in bthermal physics and continuum mechanics /b, you will guide analyses of complex physical phenomena, including steady-state and transient thermal behavior, linear and nonlinear mechanics, geometric and material nonlinearities, and contact interactions. You will bevaluate critical factors /b such as thermal risk, warpage, stress evolution, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems. /p pYou will work closely with bIMEC’s engineering teams /b to understand their technical challenges, provide expert guidance, and clearly articulate Vinci’s capabilities in solving real-world problems. Additionally, you will serve as a bkey feedback channel t /bo product and engineering teams, translating customer insights into actionable inputs that shape product direction and drive continuous improvement. /p pThis is anb onsite /brole at IMEC in Leuven, Belgium, several days per week, working remotely alongside our Sales, Product, and Engineering teams in Palo Alto, CA. The role includes moderate travel, primarily within continental Europe, bwith occasional intercontinental travel /bfor collaboration with the US team. /p h3Responsibilities /h3 ul lipbServe as the senior technical authority on thermal and thermo-mechanical simulation at IMEC /b, setting analysis methodology, defining best practices, and mentoring engineers across Vinci and partner teams without direct reporting lines. /p /li lipbDrive technical engagement with IMEC's engineering teams /b, owning simulation setup, running test cases on leading-edge devices and packages, and interpreting results to demonstrate Vinci's value. /p /li lipbPartner with the sales team /b to deliver product demonstrations, lead proof-of-concept evaluations, and drive in-depth technical discussions with prospective customers across Europe. /p /li lipbIdentify pain points and workflow gaps /b in real-world engineering practice, and work with Product and Engineering to translate them into concrete product improvements. /p /li lipbDeliver technical training sessions and workshops /b that enable engineering teams to adopt and scale Vinci within their existing simulation workflows. /p /li lipbRepresent Vinci at industry conferences and semiconductor events /b, delivering live demonstrations, presenting technical results, and engaging with prospective customers and partners. /p /li lipbMaintain deep awareness of competitive simulation technologies, industry trends, and market positioning /b, and articulate Vinci's differentiators credibly to expert audiences. /p /li /ul h3Qualifications /h3 h3Required /h3 ul lipDegree in Mechanical, Electrical, or related engineering field /p /li lipFamiliarity with semiconductor electronics packaging, advanced packaging or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.) /p /li lip15+ years of hands-on thermal management, mechanical warpage, stress and reliability using commercial software such as Flowthem, Cadence, Ansys, Abaqus, LS Dyna, etc. /p /li lipScripting experience using python or C++ /p /li lipStrong communication and interpersonal skills. /p /li lipPrior managerial or leadership Experience /p /li lipPrior experience in Customer-facing roles /p /li lipStrong problem-solving mindset and ability to quickly learn new tools and workflows /p /li lipStrong ability to communicate complex results clearly to a mixed audience (technical + business) /p /li /ul h3Preferred /h3 ul lipExperience in pre-sales, technical sales, or customer-facing engineering roles /p /li lipAbility to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools /p /li lipExper