Senior Engineer, Process Engineering | Global R&D Process Engineering Program

ph3Senior Engineer, Process Engineering | Global RD Process Engineering Program /h3pStep into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, ASM's advanced semiconductor devices play a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. /ppAs a Senior Engineer, Process Engineering within ASM’s Global RD Process Engineering Program, you will develop next‑generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program, combining structured learning with hands‑on work using ASM’s world‑leading semiconductor processing equipment. This phase is designed to accelerate technical depth, process mastery, and integration into ASM’s global RD community. /ppFollowing this phase, you will relocate to an ASM RD center in Japan, Korea, or the United States for a permanent role. /ph3Take a closer look at the role /h3ulliWork with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD. /liliDevelop innovative ideas, staying abreast of state‑of‑the‑art processing applications in the semiconductor industry. /liliProcess consulting, including writing technical papers on advanced process applications and intellectual property creation. /liliParticipate in and drive technical problem‑solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams. /liliDesign and conduct experiments, measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM). /liliTroubleshoot equipment problems and engage in hands‑on modalities. /liliWork directly with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations. /liliDevelop methods and techniques for integrating metal and/or oxide films into existing and future device technologies. /liliEnsure successful product transfer to customer base by performing demonstrations, traveling to support customer sites (up to 10% travel), and drafting documentation regarding process development, tool operation and maintenance. /liliProduce technical papers on process, equipment, and device integration improvement strategies and present to professional audiences. /li /ulh3Qualifications /h3ulliPhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics. /lili0–7+ years of combined education, research, and work experience with cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition. /liliExperience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry. /liliKnowledge of electrical characterization techniques for CMOS devices. /liliApplication of dielectric and/or metal films for logic and memory structures. /liliTraining in computational fluid dynamics (CFD), either theoretical or practical is preferred. /li /ulh3Skills /h3ulliAbility to independently manage complex process development projects. /liliCreative problem solving with experience in developing new films for emerging applications and in chemistry/materials characterization. /liliUnderstanding of interplay between hardware design (e.g., chemical reactor design) and operation and process outputs. /liliUnderstanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows. /liliDemonstrated ability to develop and fully characterize deposition processes using first principles and experimental design techniques such as DOE and RSM. /liliExperience with theory, practice and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry. /liliExcellent verbal and written communication skills, with ability to clearly communicate advanced technical concepts. /li /ulh3Work location transfer requirements /h3pFor the first 18–24 months, you will complete training at flagship process development hubs in Leuven (Belgium), or Helsinki (Finland). Upon completion, you will transfer to a Key Product Unit Process team for a permanent role in Greater Tokyo, Japan; Phoenix, Arizona, US; or Dongtan Semiconductor Valley, South Korea. /ph3Why join ASM? /h3ulliLong‑term investment in RD talent with a program designed to accelerate careers. /liliFinancially strong technology leader in ALD with a long‑term vision, values‑driven culture, and defensible IP portfolio. /liliProcess engineering at ASM is rooted in scientific rigor