Emplois de mems packaging integration – Leuven

Main Responsibilities Deliver inertial MEMS accelerometer and gyroscope sensor designs to meet target specifications with documented mechanical and electrical performance data and DFMEA analysis Collaborate with electronic designers, process engineers and test engineers to review and optimize sensor performance Work with FA and quality engineers to...

Main Responsibilities • Deliver inertial MEMS accelerometer and gyroscope sensor designs to meet target specifications with documented mechanical and electrical performance data and DFMEA analysis • Collaborate with electronic designers, process engineers and test engineers to review and optimize sensor performance • Work with FA and quality engineers...

MEMS Packaging, Integration & Modeling Expert  Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. By combining leadership in semiconductor process technology with expertise in software, system design, and application domains, imec develops breakthrough solutions for industries including healthcare,...

Join the Platform Efficiency Team at imec's R&D headquarters located in the heart of Europe and help strengthen technology and modules across imec’s many programs. This position lies in the BEOL Platform team, which takes care of 3D, Memory and Interconnect projects. At this point in time we have a particular need for an experienced Advanced Packaging (3D)...

About ElmediX: ElmediX is a medical technology company developing TempoCure®, an innovative medical device for controlled whole-body thermal treatment in oncology. The platform combines advanced temperature monitoring, thermal control, clinical workflow integration, and medical-device engineering. To support the manufacturing activities of the TempoCure...

Seniority Level: Associate Purpose of the job: You are reporting into the Technical Services Manager. You are responsible for the operational management, optimization, and security of the entire OT infrastructure within the production environment. You support all departments and play a key role in ensuring continuity, cybersecurity, data availability, and...

About NeurophosThe demand for new data centers and AI compute is rapidly outpacing the planet's energy capacity. Digital solutions are hitting a power wall as we approach the physical limits of traditional silicon. Conquering this bottleneck means rethinking the fundamental architecture of inference compute. The industry's current path can't meet the need,...

Team leader MEMS/Heterogenous Component Integration  What you will do We are looking for an experienced and ambitious professional who can lead imec’s MEMS/HCI process development and platformization group. The teams reporting to the group leader are composed of senior and junior process integration engineers working on various bilateral, funded, and...

Advanced 3D Packaging Integration LeadAdvanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for...

About GF GlobalFoundries® Inc. (GF®) is one of the world's leading semiconductor manufacturers. GF redefines innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions with leading performance in all growth markets. GF offers a unique mix of design, development and manufacturing services. With a...

  Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in...

Principal Engineer – Advanced Packaging   What you will do As a Principal Engineer you have obtained a broad, in-depth and hands-on knowledge of wafer bonding & advanced packaging processes in the semiconductor industry.  Your main responsibilities will include:  Using your expertise, you will support the team members during technical and engineering...

Director, 2.5D and 3D Advanced Packaging Technologies  What you will do In this role, you will drive the development of advanced 2.5D and 3D packaging technologies from early research through platform deployment across imec organization. Acting as the primary representative of the expert community in these domains, you will align the needs of multiple...

Process Integration Engineer TIP  At the Technology Integration & Prototyping (TIP) department we have several Process Integration positions ranging from junior to senior level across several teams - Fluidics, MEMS, heterogenous integration, photonics and imagers...  What you will do You will work within the Technology Integration & Prototyping (TIP)...

Process engineer on weekend shifts – Imager Optics Integration Components imec is a world-leading research and innovation hub in nanoelectronics and digital technologies, developing advanced solutions for sectors including healthcare, automotive, communications, and smart systems. The Imager Optics Integration Components team, part of Technology...

Process Engineer Semi-Additive Manufacturing  What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the...

R&D Engineer for bevel management  What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a...

System-Level Power and Thermal Modelling Researcher What you will do Continued technology scaling and the integration of heterogeneous technologies are increasing the complexity of power delivery, thermal management, and energy optimization across the entire computing stack. Emerging technologies such as fine-grain 3D integration, advanced packaging,...

Photonics Device talent community   We are glad that you are here! We welcome you to apply to imec’s Photonics device talent community. We seek individual contributors across a broad range of experience levels to strengthen and expand our activities across multiple photonics domains. This talent pool covers several open and upcoming positions...

Optical Wireless Communication Systems Expert We are seeking an Expert to join the PICSYS (Photonic Integrated Circuits and Systems) team at imec, focusing on the realization and demonstration of next-generation optical wireless communication (OWC) systems built on integrated photonic platforms. We are looking for a candidate with at least 2–3 years of...