Metal Interfaces for 3D Wafer Bonding Internship

Il y a 3 jours

VlaamsBrabant, Vlaams-Brabant, Belgique Imec Temps plein 8 900 € - 12 000 € Contrat

Imec invites Master or PhD interns to investigate how different surface pretreatments influence metallic surfaces for advanced 3D wafer stacking. You will design and perform experiments, analyze surface evolution, and assess bonding stability of interfaces to guide scalable processes for future 3D integration technologies.

The project aims to deepen understanding of surface preparation and bonding reliability, contributing to robust, scalable wafer bonding for diverse materials.