Metal interfaces for next-generation 3D integration
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Metal interfaces for next-generation 3D integration
Characterize how different surface pretreatments influence the chemical stability, morphology and bonding readiness of metallic surfaces for advanced 3D wafer stacking.
Type of internship: Master internship, PhD internship
Required educational background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology
The reference code for this position is 2026-INT-318. Mention this reference code in your application.
Advanced 3D wafer stacking requires reliable bonding between increasingly diverse materials. The condition of metallic surfaces before bonding—including their chemical composition, morphology and susceptibility to oxidation—can strongly influence interface quality and process robustness.
This internship will investigate how different surface pretreatments affect selected metallic surfaces. The student will define and execute an experimental study, characterize surface evolution after treatment, and evaluate the stability and bonding performances of the resulting interfaces. The work will combine surface-analysis techniques with structured data interpretation to identify the most promising treatment strategies.
The project will contribute to a better understanding of surface preparation for advanced wafer bonding and support the development of scalable processes for future 3D integration technologies.
University promotor: Stefan De Gendt (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Serena Iacovo ( Serena.Iacovo@imec.be ) and Dennis van Dorp ( Dennis.vanDorp@imec.be )
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