[NanoIC topic] Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren

/ [NanoIC topic] Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren

[NanoIC topic] Mechanics and characterisation of voiding in wafer-wafer bonding using synthetic Schlieren

This will be mainly an experimental project with heavy data analysis and some analytical modelling - to measure particle induced voiding in wafer-wafer bonding. KU Leuven supervisor: Prof Pierre-Thomas Brun

Particle-induced bond defects manifest as relativelylarge voids trapped between wafers and split the oncoming bond front. Suchvoids not only create locally unbonded gaps in the vicinity of the particle,but also create a tail of voids downstream, in the direction of the front’spropagation, as the split - bond-frontscollide with each other in closing the unbonded region. We aim to visualize thisparasitic effect of void-tail formation using high-speed imaging, and fullycharacterize their formation in terms of the mechanical parameters of thesystem.

Type of internship: Master internship

Required educational background: Physics, Mechanical Engineering

University promotor: Pierre-Thomas Brun (KU Leuven)

The reference code for this position is 2026-INT-252.

Supervising scientist(s): For further information or for application, please contact Steven Brems ( Steven.Brems@imec.be ) and Serena Iacovo ( Serena.Iacovo@imec.be ) and Utkarsh Jain ( Utkarsh.Jain@imec.be )