Master Internship: Voiding in Wafer Bonding

imec, based at Leuven, Belgium, invites Master interns to study the reliability of wafer-to-wafer hybrid-bonding, focusing on SiCN dielectric materials. The role involves data collection, preparation and analysis, and developing a lifetime model for reliability under various conditions.Supervising scientist Emmanuel Chery will guide the project. Duration is...

/ Modelisation of light matter interaction for temporary bonding applicationsModelisation of light matter interaction for temporary bonding applicationsAs the semiconductor industry pivots from traditional node scaling toward system-level innovation, temporary bonding and debonding of wafers is a key steps for next industrial development. In this internship...

Modelisation of light matter interaction for temporary bonding applications Master internship – Leuven (Posted more than two weeks ago) As the semiconductor industry pivots from traditional node scaling toward system‑level innovation, temporary bonding and debonding of wafers is a key step for next industrial development. This internship focuses on...

Reliability of 3D advanced technologies: the hybrid-bonding interface. Join us to to study the reliability of the most advanced 3D technology: wafer to wafer hybrid-bonding. Join imec, one of the world’s premier research centers in nanotechnology, at its headquarters in Leuven, Belgium, to study the reliability of the most advanced 3D technology: wafer to...

Metal interfaces for next-generation 3D integrationCharacterize how different surface pretreatments influence the chemical stability, morphology and bonding readiness of metallic surfaces for advanced 3D wafer stacking.Type of internship: Master internship, PhD internshipRequired educational background: Chemistry/Chemical Engineering, Materials Engineering,...

Photoelectrochemistry of single-monolayer MoS₂: atomic-scale control of etching and passivationUse photoelectrochemistry and ultra-trace-level ICP-MS to work out how light, band alignment and sulfur vacancies control the passivation and etching of a single MoS₂ monolayer, the atomic-scale wet chemistry that 2D-transistor processing depends on.Type of...

/ Design and Implementation of a Test Protocol Description Language for IEEE Std 1838 Flexible Parallel PortsDesign and Implementation of a Test Protocol Description Language for IEEE Std 1838 Flexible Parallel PortsBridging the 3D-IC Test Gap: Standardized test protocols for IEEE Std 1838This paradigm shift centers on decomposing a system-on-a-chip (SoC)...

/ Towards a High-Throughput Electrical Biosensing Platform with EGFETsTowards a High-Throughput Electrical Biosensing Platform with EGFETsExplore biosensing with Extended-Gate FETs for a fully-integrated real-time high-throughput biosensing platformLiquid-gated extended-gate Field-Effect Transistors (EGFETs) leverage the robustness and scalability of...

/ Integrated photonic structures for UV spectroscopy Integrated photonic structures for UV spectroscopy Sensing proteins using UV laser on sapphire chip Over the past years nanotechnology has enhanced scalability, sensitivity, and drastic cost reductions in sensing & detection of biomolecules, cells, etc. Using integrated optics, methods like Fluorescence...