Wafer-to-Wafer 3D Bonding Reliability — Master Internship

/ Modelisation of light matter interaction for temporary bonding applicationsModelisation of light matter interaction for temporary bonding applicationsAs the semiconductor industry pivots from traditional node scaling toward system-level innovation, temporary bonding and debonding of wafers is a key steps for next industrial development. In this internship...

Modelisation of light matter interaction for temporary bonding applications Master internship – Leuven (Posted more than two weeks ago) As the semiconductor industry pivots from traditional node scaling toward system‑level innovation, temporary bonding and debonding of wafers is a key step for next industrial development. This internship focuses on...

Turn groundbreaking 3D integration technologies into a manufacturing-ready platform for next-generation semiconductor products.Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution...

IC-Link by imec seeks an Advanced 3D Packaging Integration Lead to define and drive the technical roadmap for imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions.You will lead development and industrialization of imec's 3D packaging platform in current semiconductor facilities, define...

Imec invites applications for a Master/PhD internship focused on Machine Learning-Based Defect Classification and Anomaly Detection in advanced IC package 3D interconnects using Scanning Acoustic Microscopy. The project aims to automate failure analysis and improve reliability in 3D IC interconnects through data-efficient ML methods.The role requires strong...

3D and BEOL Integration ExpertWhat you will doWork in the Platform Integration Group, contributing to a diverse range of projects – such as imec Core Program projects, or imec internal projects.Focus on the platformisation or stabilisation of a wide range of flows within BEOL or 3D integration. The Platform Integration team is responsible to take a...

R&D Engineer for bevel managementWhat you will doMiniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a...

/ Machine Learning-Based Defect Classification and Anomaly Detection in Advanced IC Package 3D Interconnects Using Scanning Acoustic MicroscopyMachine Learning-Based Defect Classification and Anomaly Detection in Advanced IC Package 3D Interconnects Using Scanning Acoustic Microscopy\"Where Artificial Intelligence Meets Failure Analysis: Advancing...

Insight Global are seeking an experienced Engineering Operations Manager for a leading semiconductor technology and manufacturing organisation supporting advanced wafer processing and next-generation manufacturing operations.This position requires onsite work in Leuven, Belgium, with a future transition to Malaga, Spain as part of the organisation’s...