Advanced 3D Packaging Platform Lead

IMEC seeks an experienced Platform Integration Lead for Advanced 3D Packaging in Leuven, Belgium. You will drive the 3D Packaging Integration platform across current and future IMEC fabs, coordinating process modules, test solutions and industry-standard interfaces with OSAT partners.You will work with global teams to align PDk/ADK with industrialisation...

Imec's R&D headquarters in Leuven hosts the BEOL Platform team, focusing on 3D, memory and interconnect projects. This role targets an experienced Advanced Packaging (3D) Integration engineer who will drive process improvements and technical ownership in a collaborative, high‑tech environment.You will lead development plans, run inline characterization,...

Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.You will drive architecture with...

About Us Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking...

R&D Project Leader - Advanced Cooling Integration for High-Performance ComputingImecLeuven, BelgiumWhat you will doAs an R&D Project Leader, you will drive the development of next-generation cooling solutions for high-performance computing applications. You will take ownership of a multidisciplinary R&D program that aims to bridge advanced materials, device...

Join the Platform Efficiency Team at imec's R&D headquarters located in the heart of Europe and help strengthen technology and modules across imec’s many programs. This position lies in the BEOL Platform team, which takes care of 3D, Memory and Interconnect projects. At this point in time we have a particular need for an experienced Advanced Packaging (3D)...

TECHNICAL TRAINER – METAL ADDITIVE MANUFACTURING WHAT YOU WANT TO KNOW Hybrid working: 1–2 days working from home, depending on the training schedule Travel: Approximately 15–25% international travel Benefits: Company car, charge card, mobile phone, pension, hospitalisation insurance and meal vouchers Join a specialist team delivering technical...

MEMS Packaging, Integration & Modeling ExpertImec is a world-leading research and innovation center in nanoelectronics and digital technologies. By combining leadership in semiconductor process technology with expertise in software, system design, and application domains, imec develops breakthrough solutions for industries including healthcare, automotive,...

Vertical Compute is seeking an RTL Verification Engineer to lead the verification of its 3D-integrated chiplets and VIM-enabled AI compute modules. You will drive top-level verification, develop advanced testbenches, and work closely with Front-End RTL, System Architecture, and Software teams to ensure tape-out readiness.We seek a candidate with proven...