Director, 2.5D/3D Packaging Technologies

Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.You will drive architecture with...

imec in Leuven, Belgium is seeking a Process Engineer for Semi-Additive Manufacturing to develop and validate new temporary bonding/debonding processes with a focus on 3D-heterogeneous packaging applications. You will work in a multidisciplinary BAW team within MATA, coordinating with researchers, hardware engineers and suppliers to advance packaging...

About Us Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking...

Manage and support engineering builds activities of IC package assembly projects from concept to completion.Define project scope, timelines, and deliverables in alignment with assembly engineering activities.Track progress, identify risks, and implement mitigation strategies to ensure timely execution.Serve as the primary technical liaison between internal...

About Us We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows. By bridging the gap between traditional...

Project Architect Backend What you will do IC-Link by Imec project architect team is looking for a technical customer engagement expert to support business development activities. In this role, you will oversee multiplecustomer ASIC/SoC projects and provide manufacturing solutions for package, test and qualification related activities. A relevant technical...

Process Engineer Semi-Additive Manufacturing What you will do Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the...

System-Level Power and Thermal Modelling Researcher What you will do Continued technology scaling and the integration of heterogeneous technologies are increasing the complexity of power delivery, thermal management, and energy optimization across the entire computing stack. Emerging technologies such as fine-grain 3D integration, advanced packaging,...

R&D Engineer for bevel managementWhat you will doMiniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a...