Process Engineer, Semi-Additive 3D Packaging
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imec is seeking a Process Engineer for Semi-Additive Manufacturing to advance temporary bonding/debonding processes in 3D-heterogeneous packaging applications. You will work in the Bonding, Assembly and Wafer level packaging team (BAW) within the Materials, Transfer and Assembly group (MATA) at imec’s Leuven, Belgium site, collaborating with researchers, engineers and external partners.
You will define new processes, develop metrology, perform materials characterization, and contribute to imec’s