Senior Engineer, Advanced Packaging
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IMEC seeks a Principal Engineer for Advanced Packaging to leverage broad, in-depth expertise in wafer bonding and packaging processes within the semiconductor field. You will coach the team, set up efficient processes, and translate area needs into strategic roadmaps for ongoing development.
You will stay current with new technologies, build cross-group collaborations, and act as a technical spokesperson across fora, guiding long-term initiatives and market exploration for tool acquisitions.