Advanced 3D Packaging Integration Lead

pTurn groundbreaking 3D integration technologies into a manufacturing-ready platform for next-generation semiconductor products. /ppAdvanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for prototyping and manufacturing. /ppYou will work at the intersection of technology development, semiconductor manufacturing, design enablement and the global packaging supply chain. Your goal will be clear: make imec's originated advanced 3D integration technologies ready for reliable use by customers and manufacturing partners. /ppIC-Link by imec is imec's chip development and manufacturing services division. We help start-ups, universities, SMEs and established technology companies move from an innovative chip concept to a qualified, manufacturable product. Our services cover chip design, packaging, testing, qualification and supply chain management. /ph3What you will do /h3pAs Advanced 3D Packaging Integration Lead, you will define and drive the technical roadmap for IC-Link imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions. /ppMore specifically, you will: /pulliLead the development and industrialization of imec's advanced 3D packaging platform in current and future semiconductor fabrication facilities. /liliDefine and optimize integration flows for technologies such as silicon interposers, microbumps, redistribution layers, through-silicon vias, die-to-wafer bonding and wafer-to-wafer bonding. /liliDrive platform readiness through test vehicles, customer programs and continuous process improvements. /liliEnsure that process design kits and assembly design guidelines are developed and maintained to support successful platform adoption. /liliAlign the platform with the broader manufacturing ecosystem, including fab, test and outsourced assembly and test partners. /liliCollaborate with experts across process integration, design, manufacturing, testing and reliability to resolve technical challenges and support industrialization. /liliRepresent imec towards customers and partners by presenting the platform roadmap, benchmarking industry developments and supporting technology transfers to manufacturing partners. /li /ulh3What we do for you /h3pWe offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow. /ppWe are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. /ppWe are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. /ph3Who you are /h3pYou are an experienced semiconductor professional who combines deep technical expertise with the ability to guide multidisciplinary teams and engage confidently with customers and manufacturing partners. /ppTo succeed in this role, you bring: /pulliA master's degree or PhD in semiconductor engineering, microelectronics, materials science, electrical engineering or a related field. /liliMore than 10 years of relevant experience in a semiconductor foundry, manufacturing or advanced packaging environment. /liliStrong experience with wafer-level 3D integration and advanced packaging process flows. /liliPractical knowledge of technologies such as redistribution layers, microbumps, silicon interposers, through-silicon vias, die-to-wafer bonding or wafer-to-wafer bonding. /liliThe ability to discuss complex process and integration challenges with fab engineers, designers, test specialists and manufacturing partners. /liliExperience translating technology development into manufacturing requirements and roadmap decisions. /liliStrong stakeholder management and project leadership skills. /liliThe confidence to represent imec in customer meetings and discussions with international semiconductor partners. /liliExcellent written and spoken English. /li /ulpExperience working with outsourced semiconductor assembly and test partners is strongly valued. Familiarity with electronic design automation tools and the development or use of process design kits is considered an advantage. /ph3You do not need