Advanced 3D Packaging Platform Lead

Il y a 5 heures

Flemish Brabant, Flanders, Belgique imec Temps plein
pIC-Link by imec seeks an Advanced 3D Packaging Integration Lead to define and drive the technical roadmap for imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions. /ppYou will lead development and industrialization of imec's 3D packaging platform in current semiconductor facilities, define and optimize flows for interposers, microbumps, redistribution layers, TSVs, and die-to-wafer bonding, and ensure platform readiness through /p